Applicable package type:
1.QFP, LQFP, TSOP, PLCC, SOT, SOD series;
2. Matrix SOP, SSOP, TSSOP series;
3. Chip tantalum, chip sensing and high requirements of DIP, TO, etc.;
4.DIP and SDIP series
Application:It is mainly used for the post-process packaging of integrated circuits and semiconductor devices.
Features:Multi-pots & multi-plungers. Implement short distance filling.
Advantages:Good plastic sealing technology, packaging quality improvement; The mold box adopts quick change structure, easy to use and maintenance.
